cooling system utilizing carbon nanotubes for cooling of electrical systems

ABSTRACT

A cooling system to cool the airflow through a electrical system includes a CNT heat exchanger module disposed within a housing of the electrical system, a cooling device configured to receive a coolant, a unit board disposed within the housing of the electrical system, and an air flow device configured to pass air across at least a portion of the unit board and at least a portion of the CNT heat exchanger module. The CNT heat exchanger module includes a member having a hole defined therethrough and a plurality of carbon nanotubes (CNTs) attached to the member. The coolant is propagated through the hole in the member so as to dissipate the heat generated by the electrical system.

BACKGROUND OF INVENTION

1. Field of the Invention

Embodiments disclosed herein generally relate to a cooling system forcooling computer servers. More specifically, embodiments disclosedherein relate to an improved cooling system employing carbon nanotubes(CNTS) for use with computer servers.

2. Background Art

Removal of heat has become one of the most important challenges facingcomputer system designers today. The computer industry is challenged bythermal management of their high performance and high power electroniccomponents. A number of attempts to improve thermal cooling have beentaken in the past, such as by reducing thermal resistance of fan-drivencooling air and the junction temperature of high heat flux electroniccomponents, such as central processing units (CPUs),application-specific integrated circuits (ASICs), and other high heatelectronic components. However, the ever increasing demand forprocessing speed is pushing the envelope beyond what is attainable usingtraditional air cooling systems.

As the rate of power dissipation from electronics components, such ashigh performance server units, continues to increase, as shown in FIG.1, standard conduction and forced-air convection fan air coolingtechniques no longer provide adequate cooling for such sophisticatedelectronic components. A major obstacle in efficient thermal managementof high power computer servers is the presence of hot spots on theelectronic components and the inability of air cooling schemes toeffectively remove heat directly from a point of generation. Thereliability of electronic systems suffers when high temperatures at hotspot locations are permitted to persist. Conventional thermal controlschemes, such as air cooling with fans, thermoelectric cooling, heatpipes, and passive vapor chambers have either reached their practicalapplication limit, or will soon become impractical for high powerelectronic components such as computer server units.

When standard cooling methods are no longer adequate, computermanufacturers have to reduce the speed of their processors to match thecapacity of existing cooling apparatus, take a reliability hit due toinadequate cooling using existing cooling apparatus, or delay release oftheir product until a reliable cooling apparatus for removal of heatfrom high heat dissipating electronic components are made available.Additionally, thermal management of high heat flux server unitsnecessitates the use of bulky heat fan and heat sink assembly units.

SUMMARY OF INVENTION

In one aspect, embodiments of the present invention relate to a coolingsystem to cool the airflow through a electrical system, comprising: aCNT heat exchanger module disposed within a housing of the electricalsystem, the CNT heat exchanger module comprising: a member having a holedefined therethrough; and a plurality of carbon nanotubes (CNTs)disposed on the member; a cooling device disposed within the housing ofthe electrical system and configured to receive a coolant, wherein thecoolant is propagated through the hole in the member so as to dissipatethe heat generated by the electrical system; a unit board disposedwithin the housing of the electrical system; and an air flow deviceconfigured to pass air across at least a portion of the unit board andat least a portion of the CNT heat exchanger module.

In one aspect, embodiments of the present invention relate to a coolingapparatus for cooling an electrical system comprising: a member having ahole defined therethrough disposed near a heat-generating unit board; aplurality of carbon nanotubes (CNTs) attached to the member, wherein acoolant is propagated through the hole in the member so as to dissipatethe heat generated by the heat-generating unit board; and an air movingdevice for moving air across at least a portion of the heat-generatingunit board and across at least a portion of the member.

In one aspect, embodiments of the present invention relate to a methodof cooling air flow through an electrical system, comprising: disposinga cooling apparatus near a heat-generating unit board, wherein thecooling apparatus comprises at least a member with CNTs disposed on themember; connecting the member to a cooling device; moving air across theheat-generated unit board; moving air across the member; and movingcoolant from the cooling device through the member so as to transferheat generated by the heat-generating unit board.

Other aspects and advantages of the invention will be apparent from thefollowing description and the appended claims.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 shows a view of a prior art charting of power usage over time forpackaging of electrical components.

FIG. 2 shows carbon nanotube (“CNT”) heat exchanger modules disposednear hot spots on an electrical component within a unit board and CNTheat exchanger modules disposed between unit boards and generally in thepath of the airflow within the overall housing in accordance withembodiments disclosed herein.

FIG. 3 shows the flow of air along at least one unit board and at leastone CNT heat exchanger module.

FIG. 4 shows a CNT heat exchanger modules disposed near a unit boardcomprised of at least one electrical component in accordance withembodiments disclosed herein.

FIG. 5 shows an arrangement of unit boards and CNT heat exchangermodules in accordance with embodiments disclosed herein.

FIG. 6 shows an arrangement of a unit board with CNT heat exchangermodules in accordance with embodiments disclosed herein.

FIG. 7A shows a CNT heat exchanger module connected to a condenser andcompressor in accordance with embodiments disclosed herein.

FIG. 7B shows a CNT heat exchanger module connected to a liquid pump andcooling coil in accordance with embodiments disclosed herein.

FIG. 8A shows a plurality of CNT heat exchanger modules connected to acondenser and at least one compressor in accordance with embodimentsdisclosed herein.

FIG. 8B shows a plurality of CNT heat exchanger modules connected to acooling coil and at least one liquid pump in accordance with embodimentsdisclosed herein.

FIG. 9 shows a member with a certain size and shape wherein the CNTs areattached and arranged in accordance with embodiments disclosed herein.

FIGS. 10A and 10B show a CNT heat exchanger module comprised of at leastone member, carbon nanotubes (“CNTs”), and a porous material that coversthe member and CNTs in accordance with embodiments disclosed herein.

FIGS. 11A-11E show members with CNTs attached of variable size and shapein accordance with embodiments disclosed herein.

FIG. 12 shows a view of a member with CNTs attached thereto inaccordance with embodiments disclosed herein.

FIGS. 13A and 13B show members comprised of a combination of materialsin accordance with embodiments disclosed herein.

FIG. 14 shows a member with CNTs attached to the exterior and to theinterior in accordance with embodiments disclosed herein.

FIGS. 15A and 15B show a second member within a member both having ahole therethrough in accordance with embodiments disclosed herein.

FIGS. 16A, 16B, and 16C show members wherein different types and sizesof CNTs are attached at different angles in accordance with embodimentsdisclosed herein.

DETAILED DESCRIPTION

Specific embodiments of the present invention will now be described indetail with reference to the accompanying figures. Like elements in thevarious figures may be denoted by like reference numerals forconsistency.

Advances in nano-materials and the development of economical and robustmanufacturing methods for carbon nanotubes is making it possible toincorporate carbon nanotube (“CNT”) technology design and fabrication ofheat exchangers using highly efficient CNT technology. When used as aheat absorbing and heat rejecting heat exchanger for an active coolingunit (pumped liquid or refrigeration system), substantial amount of heatmay be removed without need for use of bulky and inefficientconventional refrigeration components.

Referring now the FIG. 2, a unit board 11 comprised of at least onecircuit board 13 with integrated circuits 14 attached thereto, with CNTheat exchanger modules 8 disposed with different positional arrangementsin relation to each other, is shown in accordance with an embodiment ofthe invention. Further, additional CNT heat exchanger modules 8 a may beplaced at particular IC hot spots 14 for additional cooling. Theseadditional CNT heat exchanger modules 8 a may be sized and shaped forcooling IC hot spots 14 specifically. Additional CNT heat exchangermodules may also be placed between levels within the housing of acomputer server for additional cooling.

In other embodiments of the invention, thermal management of a high heatflux server box is achieved using a cooling system 15, which may includea removable modular liquid or refrigeration unit utilizing CNT heatexchangers 8, for cooling of the heat generating processor andelectronics components by placing the self-contained and easilyremovable CNT heat exchanger modules 8 in the direction of cooling airflow 3 at desired locations in a server chassis, also known as a housing12. CNT heat exchangers 2 absorb the heat, acting as the absorbing unitof the active cooling system, from the propagation of air over the CNTheat exchangers causing the absorption of heat by the cooling coil(heating of the cooling fluid in the case of liquid cooling and boilingof refrigerant in the case of the refrigeration cooling, wherein bothmay be called coolants) and therefore reducing the temperature of theair flowing through the heat absorbing CNT heat exchanger. Absorbed heatis then moved through a member, with a hole defined therethrough, usingthe coolant and the absorbed heat is released to the ambient away fromthe electronics components over the board and out of the server chassis.In accordance with other embodiments of the invention described herein,a miniature liquid pump or a miniature refrigeration compressor unit maybe used with the CNT heat exchanger module. The advantage of such adesign is the increase in thermal performance and a reduction in costfor the packaging material, allowing traditional air-cooling schemes tobe used for thermal management of high heat processors. Anotheradvantage is minimizing the size and space utilization due to the highthermal performance of CNT heat exchangers. Further, the ability to formand build heat exchangers of different geometrical configurations mayalso be an advantage of the design.

Referring now to FIG. 3, air entering the cooling system 15 passingthrough the housing 12 and propagating over a first unit board 11 isshown in accordance with an embodiment disclosed herein. After passingover the unit board 11, the air is at a temperature Tc1, which iscomparably hotter than the initial air coming in. The air then passesthrough a CNT heat exchanger module 8 and is cooled down to a coolertemperature. The air then continues to travel over another unit board 11causing it to heat and then over at least one CNT heat exchanger module8 for cooling. For example, the air may be cooled to room temperature,and the cooled air will be re-used to cool down the next unit board.Known CNT fabrication technology may enable the design, creation andplacement of CNT heat exchangers of various shapes at various locations,thus the air flowing over the heat generating electrical components,such as processors and ASICS, may be lowered to the design temperature.Therefore, multiple CNT heat exchangers may help in maintaining the airtemperature flowing over an array of electrical components.

Referring now the FIG. 4, a unit board 11 comprised of at least onecircuit board 13 with integrated circuits 14 attached thereto, with CNTheat exchanger modules 8 disposed with different positional arrangementsin relation to each other, is shown in accordance with an embodiment ofthe invention. This embodiment illustrates that a CNT heat exchangermodules 8 may not need to cover the entire airflow stream and may beselectively placed to help cool select portions of the unit board 11.Further, the hole openings to the members of the CNT heat exchangermodules 8 need not be found on the same side, thereby allowing for abalancing of cooling devices as opposed to having to have an off balancearrangement of cooling devices off one side of the computer server oradditional member extensions to reach remote cooling devices placedelsewhere due to other design considerations.

Referring now to FIG. 5, a cooling system 15 is shown in accordance withan embodiment of the invention. By using the high thermal conductivityof carbon nanotube heat exchanger fins 2, the size may be dramaticallyreduced and the heat exchanging efficiency is greatly improved.Therefore, CNT heat exchanger modules 8 may be placed between unitboards 11, both of which are within the housing 12 of the electricalsystem or computer server. Further, the unit boards 11 and the CNT heatexchanger modules 8 are arranged such that the airflow 3 goes from aunit board 11 to pick up heat, then to a CNT heat exchanger module 8 todissipate the heat and then onto the next heated unit board 11. As seenin FIG. 6, other embodiments exist for a unit board 11 that generatemore heat than one CNT heat exchanger module 8, also known as a CNT heatexchanger module 8, may dissipate alone or for a unit board 11 thatrequire a lower initial air temperature passing over. In theseembodiments, a second, and even a third, or potentially more, CNT heatexchanger modules 8 may be placed in a row to lower the temperature ofthe air. As a result, a CNT heat exchanger module 8 utilizing CNT heatexchangers 2, also known as a modular removable active cooling unit 8for a given embodiment, may assist fan air cooling schemes to providecooling for much higher levels of heat removal without requiring the useof many oversized heat sinks or a greater number of cooling fans.

Referring now to FIGS. 7A and 7B, the CNT heat exchanger modules 8 maybe used with either a refrigeration type cooling mechanism 9 (shown inFIG. 7A) or a liquid-pump type cooling mechanism 10 (shown in FIG. 7B).For the refrigeration type cooling mechanism, a compressor 9 b and acondenser 9 is utilized to achieve the desired coolant cooling as itpropagated through the CNT heat exchanger module 8. For the liquid-pumpcooling mechanism, a liquid pump 10 b and a cooling coil 10 are utilizedto achieve the desired cooling as the coolant propagates through the CNTheat exchanger module 8 collecting the thermal energy. A person ofordinary skill in the art can appreciate that there may be morecomponents in a refrigeration or a liquid cooling system.

In other embodiments of the invention, more than one CNT heat exchangermodule 8 are attached to a refrigeration system 9 comprised of acondenser and at least one compressor as shown in FIG. 8A. Additionally,a single compressor may be used rather than individual compressors 9 bfor each of the CNT heat exchanger modules 8. Similarly, for embodimentsusing a liquid-pump system 10 as shown in FIG. 8B, more than one of theCNT heat exchanger modules 8 may be attached to the same liquid-pumpsystem 10, wherein the liquid-pump system comprises at least one coolingcoil 10 and at least one liquid pump 10 b.

FIG. 9 shows an embodiment of the invention in which a member 1 isformed into a shape having three of four sides of a rectangle and hasthe plurality of CNTs attached vertically thereto. Other embodiments ofthe invention, for example as shown in FIG. 10A, have a member 1 andCNTs 2, which are formed as CNT heat exchanger fins, enclosed within aporous material 7, also called a porous module 7. The porous material 7may provide a more rigid or durable property to the CNT heat exchangermodule 8 while still allowing for air to flow through and over the CNTs2 and the member 1. The CNT heat exchanger module 8 has the benefit ofcreating a modular component that may be placed and removed with easefrom within and around desired installation points. Specifically,placing the modular components near unit boards while also being in thepath of air flowing through the electrical system, specifically acomputer server.

In other embodiments of the invention, a CNT heat exchanger module, alsoknown as a modular removable active cooling unit 8, utilizing CNT heatexchangers 2 are used for cooling and thermal management of high heatserver boxes. In addition to providing substantial heat removal ability,these embodiment allow for the reduction in size and the number of heatsink and all other second level thermal management mechanism currentlyin practice.

Further, other embodiments of the invention, for example as shown inFIG. 10B, illustrate that a CNT heat exchanger module 8 may also be madeup of more than one member 1 each with attached CNT heat exchanger fins2. More specifically, both members may be enclosed within the sameporous module 7. This allows for larger CNT heat exchanger modules thathave the same density and coolant flow as the CNT heat exchanger moduleembodiment of FIG. 10A while also retaining the modular nature.

Referring now to FIGS. 11A through 11E, a member 1 configured in anyshape desired is shown in accordance with embodiments disclosed herein.This feature allows for design flexibility and maximization of surfacearea with which to provide contact with the airflow 3 in any givenelectrical system that is being cooled. Specifically, FIG. 11A shows anembodiment wherein the member 1 bent is a plurality of shapes any one ofwhich may be chosen or a combination may be used. FIG. 11B discloses anembodiment wherein the member 1 is sized to be small while still havingthe CNTs attached thereto, which provides a system that is microfluidic.A person of ordinary skill in the art knows that microfluidics dealswith the behavior, precise control, and manipulation of fluids that aregeometrically constrained to a small, typically sub-millimeter, scaleand would also be familiar with the components used for such anapplication. Other embodiments provide a member 1 that is almost thesame size as the CNTs that are attached, which would provide a systemthat is nanofluidic. Similarly, a person of ordinary skill in the art isfamiliar with the components used in a nanofluidic application. Usingthe existing CNT growth technology, a desirable microchannelconfiguration with a fine control on the microchannel's flow passagewidth, length, and geometrical configurations may be build to maximizethe ability of the cooling systems for the highest and most effectiveheat removal ability for the most restrictive server location.

Other embodiments provide a member 1 that is far larger than the CNTsattached thereto as shown in FIG. 11C. Other embodiments of theinvention provide for a member 1 that is bent is such a manner as torequired three axis's creating a three dimensional shape, shown in FIG.11D. Other embodiments allow the entering direction 4 and the exitingdirection 5 to vary in angle, as opposed to having the enteringdirection 4 and the exiting direction 5 at 180 degrees from each other,as shown in FIG. 11E.

Referring now to FIG. 12, a member 1 is shown with at least one CNT 2attached in accordance with an embodiment disclosed herein. The memberhas a hole that extends therethrough, and through which a coolant ispropagated. The coolant may be either a gas or liquid coolant. Themember 1 is placed along the airflow path 3 of an electrical componentcooling system that is cooling an electrical system using the airflow 3.The airflow 3 is designed to travel over heat producing electricalsystems such as computer components like CPUs and memory units. Thethermal energy picked up by the air as the air passes over theelectrical components, moves along, and passes over the member 1 and theCNTs 2 attached to the member 1. The thermal energy is transferred tothe member 1 and the CNTs 2, thereby cooling the air in the airflow 3.The thermal energy is then transferred laterally down the CNTs 2 to themember 1. Next, both the thermal energy from the CNTs 2 and the member 1are transferred to the coolant that is flowing through the member 1entering 4 and exiting 5 from one end of the member to the other.

Referring now the FIGS. 13A and 13B, a member 1 is shown that is formedfrom a combination of materials in a composite-like layered form inaccordance with an embodiment disclosed herein. Specifically, in FIG.13A, the member 1 is formed from a CNT that is then wrapped with metalsuch as copper or metal alloy. In FIG. 13B, a member 1 is shown in whichthe inner layer of the member 1 is a metal followed by a CNT which iscovered in another layer. Other embodiments may exist where the member 1comprises at least one of a metal, a polymer, a plastic, an epoxy, aCNT, or any combination of such materials. A desired combination, or useof a specific material, will depend on the thermal conductivity desired,fabrication ability and limitations, as well as the size, shape, andstrength needed for the member 1 given a desired cooling application.The ability to use any of a plurality of materials for the memberstructure provides a designer the flexibility to create a large varietyof designs to fit many types of cooling applications.

Referring now to FIG. 14, a member 1 is shown with CNTs 2 attached toboth the interior and the exterior surface of the member 1 in accordancewith an embodiment disclosed herein. By allowing for placement of CNTson the exterior, similar to FIG. 12, the surface area that comes intocontact with the incident airflow 3 may be increased and heat transfer,and therefore cooling, may be increased and thereby improveddramatically. Similarly, CNTs 2 may be placed along the inside of amember 1 so that the surface area that comes into contact with thecoolant traveling through that space is increased as well.

FIGS. 15A and 15B refer to an embodiment of the invention known as asecondary loop indirect-contact cooling system. Specifically, thisembodiment includes a member 1 with a hole therethrough. Additionally,this embodiment has a second member 6 that also has a hole therethrough.The second member 6 is disposed within the hole of the first member 1.As shown in FIG. 15B, the coolant, coming from the refrigeration orliquid cooling system, will propagate in a direction 4 in through thehole in the first member 1 and then propagate in a direction 5 outthrough the hole in the second member 6 back to the refrigeration orliquid cooling system. CNTs (not shown) may be located on any one of thesurfaces, such as, the interior or exterior of the first member 1, orthe interior or exterior of the second member 6. Further, the CNTslocated between the interior of member 1 and the exterior of the secondmember 6 may be disposed such that one end of the CNT attaches to theinterior surface of member 1 and the other end of the CNT attaches tothe exterior of the second member 6. This would provide a dual benefitof first increasing the surface area through which the thermal energymay be passed to the propagating coolant in the hole, or chamber, ofmember 1. Secondly, this may provide structural support for the secondmember 6 and for the overall cooling system.

In the FIGS. 15A and 15B, the shapes of both members 1 and 6 are shownto be the same, however, other embodiments exist where the members areany of a plurality of shapes. Further, FIGS. 15A and 15B show the secondmember 6 disposed in the middle of the hole of member 1, although otherembodiments exist where the second member 6 is located closer to, orconnected to the edge of member 1.

One benefit of the embodiments shown in FIGS. 15A and 15B and discussedabove is the use of a single stretch of material, in the shape of amember with an additional internal second member, to provide thefunctionality of both transmitting and returning of the propagatingcoolant from a single end of the member 1. This lowers the number ofconnection locations needed to a cooling device, thereby lowering thepossibility of leaks. In a case where a leak does occur, repair issimplified for at least the reason that because there is only oneconnection location, it may be the only connection location at which aleak may occur. One benefit of an embodiment where the second member 2is design as a thermal insulator rather than a conductive member is thatthe coolant that is thermally saturated will not propagate along theconductive interior surface of the first member 1, but rather throughand within the second member 2 which would be insulated so as toeliminate heat transfer back out through the member 1 to the CNTs 2 orthe airflow 3.

Referring now to FIG. 16A, a plurality of different CNTs of all shapessizes, lattice structures, and wall thicknesses may be used incombination or alone providing a large variety of embodiments. Once aCNT type is chosen, the CNTs 2 may be attached to the member 1 at anyangle and still perform the desired functionality, as shown in FIG. 16B.This is useful because having the flexibility to attached the CNTs atdifferent angles allows for the use of cheaper and faster methods ofmanufacture. Further, a combination of both type and angle could be usedin other embodiments of the invention thereby not only still providingfor increased surface area, but also, providing a cost effective methodof manufacture and potentially upkeep as well. In other embodiments ofthe invention, the CNT type and attaching angle that provides themaximum surface area is chosen depending on the given cooling to bedone. The CNT type and angle of attachment may be chosen independentlyor dependently of the shape of the member 1 chosen as shown in FIG. 16C.In other embodiments of the invention, one CNT type is chosen and isattached at a perpendicular angle to the surface of the member 1. See,for example, FIG. 9. Another embodiment of the invention is anapplication where CNT heat exchangers are used for direct heat removalby attaching a liquid or refrigeration-cooled CNT heat sink to the back(or lid) of a high heat dissipating processor.

In addition to the above discussed benefits and advantages, embodimentsof the present disclosure may provide for one or more of the followingadvantages. First, embodiments disclosed herein may provide for activefluid cooling that may provide desired thermal management solution to awide range of thermal dissipation applications. Additionally,utilization of CNT material and technology may provide the highest knownthermal conductivity (higher than diamond) for a heat exchange mediumwhile possibly providing geometrical flexibility for desirable andspace-fitting heat exchanger design and fabrication. Further, theapplication of a cooling system in according with one of the aboveembodiments may dramatically improve thermal management of high powercomputer servers by reducing temperature of the cooling air to inletconditions at any given location inside of the server box. The proposedembodiments may provide the ability to utilize effective cooling mediumsranging from water, water-glycol, dielectrics to direct expansionrefrigeration coolants that are associated with the high thermalconductivity of the CNT material. This may provide the highest level ofthermal transport ever experienced in the electronics industry.

Combining highly conductive CNT material in the form of configurablemicrochannel heat exchangers with an active refrigeration or liquidcooling solution may provide the widest range of thermal managementschemes ever developed in the electronics industry for flexible coolingof electronics components in data centers. As opposed to otherapplications of active cooling systems, utilizing CNT technology mayprovide the most efficient and flexible manufacturing method forbuilding heat exchangers used in a closed loop of an active coolingsystem. By virtually removing the hot regions inside of a server box,through a cooling system 15 as described in the above embodiments whichutilize highly flexible CNT microchannel heat exchangers 2, thereliability of the parts may be increased. Using a removable modularcooling system as described at least one of the above embodiments, whichutilize CNT technology in heat exchangers, may provide an opportunityfor drastically reducing the cost of thermal management of servers indata centers by minimizing irreversibility and inefficiencies associatedwith the traditional computer room air conditioner (“CRAC”), fans andheat sink schemes.

While the invention has been described with respect to a limited numberof embodiments, those skilled in the art, having benefit of thisdisclosure, will appreciate that other embodiments may be devised whichdo not depart from the scope of the invention as disclosed herein.Accordingly, the scope of the invention should be limited only by theattached claims.

1. A cooling system to cool the airflow through a electrical system,comprising: a CNT heat exchanger module disposed within a housing of theelectrical system, the CNT heat exchanger module comprising: a memberhaving a hole defined therethrough; and a plurality of carbon nanotubes(CNTs) disposed on the member; a cooling device disposed within thehousing of the electrical system and configured to receive a coolant,wherein the coolant is propagated through the hole in the member so asto dissipate the heat generated by the electrical system; a unit boarddisposed within the housing of the electrical system; and an air flowdevice configured to pass air across at least a portion of the unitboard and at least a portion of the CNT heat exchanger module.
 2. Thecooling system of claim 1, wherein the CNT heat exchanger module furthercomprises a porous material that encloses at least a portion thereof. 3.The cooling system of claim 1, wherein at least one of the plurality ofCNTs is attached to the member.
 4. The cooling system of claim 1,wherein at least one of the plurality of CNTs is monolithically formedwith the member.
 5. The cooling system of claim 1, wherein theelectrical system is a computer server.
 6. The cooling system of claim1, wherein the CNT heat exchanger module is fluidly connected to thecooling device.
 7. The cooling system of claim 1, wherein the coolant isat least one of a liquid and a gas for cooling.
 8. The cooling system ofclaim 1, wherein the CNT heat exchanger module comprises a plurality ofCNT heat exchanger modules, wherein each of the plurality of CNT heatexchanger modules are fluidly connected to the cooling device.
 9. Thecooling system of claim 1, wherein the CNT heat exchanger module isremovably attached to a cooling device.
 10. The cooling system of claim1, wherein the cooling device comprises one of a pumped liquid systemand a refrigeration system.
 11. The cooling system of claim 1, wherein across-section of the member comprises one of a circular shape, an ovalshape, a rectangular shape, a square shape, and a triangular shape. 12.The cooling system of claim 1, wherein the member comprises at least oneof a metal, a polymer, a plastic, an epoxy, and a CNT.
 13. The coolingsystem of claim 1, wherein the CNT heat exchanger module furthercomprising: a second member having a hole defined therethrough with aplurality of CNTs attached thereto; wherein porous material is disposedabout at least a portion of the second member.
 14. The cooling system ofclaim 1, wherein at least one of the plurality of CNTs comprises one ofa single-walled CNT and a multi-walled CNT.
 15. The cooling system ofclaim 1, wherein at least one of the plurality of CNTs comprises one ofan armchair structure, a zigzag structure, and a chiral structure. 16.The cooling system of claim 1, wherein the CNTs are attached to one ofat least an inner surface and an outer surface of the member.
 17. Thecooling system of claim 1, further comprising: an internal member havinga hole defined therethrough; wherein the internal member is disposedwithin the first member.
 18. The cooling system of claim 17, wherein theinternal member comprises a plurality of CNTs attached thereto.
 19. Acooling apparatus for cooling an electrical system comprising: a memberhaving a hole defined therethrough disposed near a heat-generating unitboard; a plurality of carbon nanotubes (CNTs) attached to the member,wherein a coolant is propagated through the hole in the member so as todissipate the heat generated by the heat-generating unit board; and anair moving device for moving air across at least a portion of theheat-generating unit board and across at least a portion of the member.20. The cooling apparatus of claim 19, wherein the member is fluidlyconnected to a cooling device.
 21. The cooling apparatus of claim 19,further comprising a CNT heat exchanger module comprised of a porousmaterial disposed about at least a portion of the member and theplurality of CNTs.
 22. A method of cooling air flow through anelectrical system, comprising: disposing a cooling apparatus near aheat-generating unit board, wherein the cooling apparatus comprises atleast a member with CNTs disposed on the member; connecting the memberto a cooling device; moving air across the heat-generated unit board;moving air across the member; and moving coolant from the cooling devicethrough the member so as to transfer heat generated by theheat-generating unit board.
 23. The method of cooling air flow throughan electrical system of claim 22, further comprising: dissipating heatfrom the coolant with a cooling device fluidly connected to the member.